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India’s First Advanced 3D Glass Semiconductor Packaging Unit Foundation Laid in Bhubaneswar

New Delhi: Odisha has taken a decisive step into the semiconductor era with the groundbreaking of India’s first advanced 3D glass substrate-based semiconductor packaging...

Breaking

BRICS Indore Declaration 2026

New Delhi: In a landmark development for international agricultural cooperation,...

CUET PG 2026 Scam by NTA

New Delhi: The National Testing Agency (NTA), established to...
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